Even as Apple's iPhone 7 and iPhone 7 Plus devices are highly expected to be unveiled by September, leaks related to the model are continuing to pop up around the internet. The latest leak includes internal body images of the iPhone 7, which shows its motherboard, 2 GB of RAM, SIM connector and the next-generation faster processor 'A10'.
Last month it was reported that Apple's iPhone 7 and 7 Plus/Pro press event is likely to be conducted on September 6, and Apple would apparently open up pre-orders for the new smartphones on September 9. In other reports, Apple is speculated to roll out the iPhone 7 and iPhone 7 Plus/Pro on September 16.
The newest leaked images purportedly show the motherboard of the devices, as well as an A10 processor that will make its debut on the mobile device. The SIM slot connector on the board is placed under the A10 and M10 motion processors, which are said to be exclusively made by TSMC. In terms of on board RAM, the motherboard contains 2 GB of RAM, however reports also suggest that the larger 5.5-inch iPhone 7 Plus/Pro will be packed with 3GB of RAM because of its dual-lens rear camera.
The latest leak makes up for the lack of a new design features in the upcoming Apple devices. It appears the major focus will be on the phones' internal upgrades, new 3D Touch Home button and enhanced rear cameras, which will be the same technology as used by Apple in the trackpads of the MacBook Pro and MacBook.
Another huge upgrade in the upcoming devices is the missing standard 3.5 mm headphone port, which may upset some users, but the company is likely to include new EarPods to take their place.